Circuit Component Flexibility

• Ability to provide a wider range of types and values of active functions
• Ability to provide a wider range of types and values of passive functions (e.g. resistance, capacitance, inductance etc.)
• Active devices can retain their optimum performance characteristics with active trimming
• Breakdown voltages are increased
• Ratio matching of resistors to less than 1%
• Resistance range could be from 30mΩ to 12GΩ
• TCRs of resistors could be from 50 and 100 ppm/C
• The resistors are easy to be trimmed to better than  1%


• Better yield
• Design flexibility
• Low development cost
• Lower assembly costs
• Lower cost for matched, close-tolerance components
• Lower purchasing, inventory control and production costs
• Reduced incoming quality control costs
• Reduced production assembly time
• Simpler system design
• Simplified assembly

Extreme Environment Operations

• Chemical contamination resistance
• Choices in packaging options
• High vibration capability (on engine)
• Higher ambient temperature capability at >125C
• Thermal and mechanical shock
• Thermal conductivity is 100 times greater than FR4
• Thermal cycling life
• Variety of fabrication methods
• Wide material options for components, substrates and interconnections

Functional Circuit Design and Manufacture Flexibility

• Circuit parameters may be changed in manufacture
• Fast turnaround for prototypes and early production
• Flexibility in circuit assemblies – different hybrids for different specifications but with same board
• Lower nonrecurring design and tooling costs for low-to-medium volume production
• Readily adaptable to design modification
• Reduced development time and costs for low-to-medium volume products

Handling High Capability

• Availability of integral thermal vias
• Dielectric constant 7 – 10
• Dielectric loss 5×10-3
• High power packaging solutions
• Maximum frequency from 10 GHz to 22 GHz

High Performance

• Closer component spacing
• Combined analogue-digital circuitry
• Excellent component tracking
• Improved control of parasitic capacitance and short signal propagation delay through precisely controlled impedance of conductor lines and spacing
• Intimate thermal coupling using direct bonding to high thermal conductivity () substrates
• Low loss of high frequency
• Low-temperature coefficient of resistance (TCR)
• More Functions
• Precise matching resistors
• Shorter circuits paths provide higher frequency response

High Reliability

• Ability to precisely trim components (static and dynamic) for both passive and functional response
• Calibration stability over time
• Fewer connections
• Fewer intermetallic interfaces
• High accuracy over extreme temperature range
• Higher immunity from shock and vibration
• Improved specifications on circuits
• Long term stability
• Lower warranty costs
• Predictability of design
• Temperature profiling

Physical Dimensions

• High density circuits
• Higher package density (wire-bonded chips occupy less than one-fourth of PCB)
• Less weight (10 times less than PCB)
• Multi-layer structures
• Reduced packaging size
• Shorter and finer line interconnections
• Small absolute and relative tolerances

System Tests and Troubleshooting

• Available hybrid circuit pre-tested functional blocks
• Lower test times
• Repeatability

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