• Special Custom Packaging
• 10K to 100K Class Control Clean Room EnvironmentService – Product
• IC Wafer Probe and Tests
• Wafer Sawing
• Die Bonding from Wafer Rings and Waffle Packs
• 0.7 Mils to 2.0 Mils Fine Gold Wire Bonding
• 1 Mil to 20 Mils Aluminum Wire Bonding
• Polymer Circuit Printing
• Plasma Cleaning
• Chip & Wire and SMD Packages
• X-Ray Quality Checks
• Active/ Functional & Ratio Match Laser Trimming Capabilities

manufacturing picture

Copyright 2015 © Hybrionic Hybrid Electronics . All Rights Reserved

Menu Title