Multi-layer Fine Line Design
Through Hole- (Castellation)Metallization
Filled/Plugged Hole-
Metallization
Direct Flip Chip Bond
Wire Bond
Thick Copper Design
Special Heaters Design
Alumina Oxide-AL2O3
Aluminum
Stainless Steel
Polymer
Glass
Aluminum Nitrate-ALN
Ruthenium Oxide
Palladium Silver
Silver -Ag
Palladium Silver-PdAg
Platinum Silver- PtAg
Gold-Au
Platinum Palladium Silver-PtPdAg
Copper-Cu
1 MHz: 9.3 (For 96% Alumina)
1 GHz: 9.2 (For 96% Alumina)
0.1 Ohm to 15 G Ohms
+/- 0.05% (Absolute)
TCR +/- 100PPM/ °C
4 – 6 mils – Fine Line
> 10 mils – Standard
Conformal Coat, SIP,DIP,PGA,TO, Flat Pack, BGA, Flip Chips
MIL-STD, DIN, EIAJ and JEDEC Etc.
Hybrionic is well placed to help its customers to reduce time-to-market launching of products with its operational agility, flexibility and quick turnaround responses. Hybrionic also prides itself on its capability to supply products and services to the automotive industry with zero or near zero ppm quality performance since the year 2004.
Hybrionic’s special capability includes its ability to process high volume of very fragile and small 20 mils (0.5mm) flip-chip dies placement with <10 microns accuracy that comes with unique material, adhesive selection and challenging processes. Its latest state-of-the-art high speed placers are capable of achieving fifteen-microns accuracy consistently. Special Plasma processes were frequently developed to enhance its products and services’ quality.
Hybrionic’s capability to process its circuit boards (mainly AL203 and ALN substrate) in-house, help to reduce lead-time and add flexibility to product trials, evaluations and sample builds. Its capability to drill, cut, profile and scribe various type’s of substrates with various thicknesses and compositions help customers in the quick development of new products in the shortest possible timeframe.
An experienced Hybrionic engineering and manufacturing team with great length of services underpinned Hybrionic’s domain expertise in the Hybrids Circuits covering Thick Film, Chip On Board, Flip Chip, SMT, Biochip, BGA, Laser Trim, Laser Scribe/ Drill and Wafer/Ceramic dicing. Its expertise is not limited to stringent product sensitivity control, product testing, reliability control and ESD quality control in cleanroom facilities.
Hybrionic has a strong material supply chain and logistic team, focusing on procuring materials with the best cost characteristics that come with the highest quality. Its experienced planning and production team, work vigorously together with the well tuned SAP-ERP system provides consistency in On-Time Delivery, smooth production runs and customer ramps.