Hybrionic has years of experience working on Laser scribing, drilling and profiling of ceramic alumina substrate. We fabricate high-tech advanced ceramics precision components and products.
Hybrionic adopted advanced fiber laser technology to enhance quality standards, overcome increasing complex designs, and in-tandem provide cost-efficient and effective solutions for high-tech industries.
We provide turnkey solution ranging from design consultation, design drawing, prototyping, to mass production for laser cutting.
Our Laser Cutting can be generally classified into 3 broad categories for different applications, as summarized in the table below:
|Laser Scribing||Non-cut-through lines on substrate for preferential singulation. Laser markings for machine fiducial marks and parts identification.||30 to 70% cut depth for singulation for substrate thickness up to 40 mil. Process capability of > 1.67 CpK.|
|Laser Drilling||Cut-through holes on substrate||Drilled holes of various dimensions from 4 to 15 mil. Drilled through hole depth of up to 25 mil. Process capability of > 1.67 CpK.|
|Laser Profiling||Cut-through profile of various shapes for substrate physical outlines and internal slots and patterns||Off-set profiling to achieve high precision dimensional requirements. Process capability of >1.67 Cpk.|