R & D

R&D Engineering

We help to turn our customers’ concepts and ideas into competitive products. Our highly qualified R&D team have extensive experience in Active, Passive, Digital and Analogue thick film hybrid microcircuits and applications can solve business challenges, drive innovation from prototyping through final production.

Our Expertise

• PCB to ceramic thick film conversion
• Replacing chip mounted components to printed components such as resistors, capacitor
• Custom hybrid packages
• Gold wire bonding hybrid modules
• Chip scale packages
• SIP, DIP and custom pins packages
• Multi-layer fine line circuits
• Polymer Thick Film, Flex & Rigid circuit boards
• Metal Core Circuits
• Copper Thick Film circuits
• BGA Resistor, Resistor & Capacitor Network,
• Ceramic heating circuits
• LED carriers