R&D Engineering
We help to turn our customers’ concepts and ideas into competitive products. Our highly qualified R&D team have extensive experience in Active, Passive, Digital and Analogue thick film hybrid microcircuits and applications can solve business challenges, drive innovation from prototyping through final production.
Our Expertise
- PCB to ceramic thick film conversion
- Replacing chip mounted components to printed components such as resistors, capacitor
- Custom hybrid packages
- Gold wire bonding hybrid modules
- Chip scale packages
- SIP, DIP and custom pins packages
- Multi-layer fine line circuits
- Polymer Thick Film, Flex & Rigid circuit boards
- Metal Core Circuits
- Copper Thick Film circuits
- BGA Resistor, Resistor & Capacitor Network,
- Ceramic heating circuits
- LED carriers
