SMT Assembly & Box Build Solutions
Our SMT assembly and box build services solve tomorrow’s integration challenges.
All processes are done in-house; from collaborative co-design, thermal/mechanical simulation, rigorous BOM validation to full scale manufacturing.
Advanced SMT Solutions
Our SMT assembly streamlines high-complexity builds with:
Full-Range Package Compatibility: Latest-generation mounters handle 01005 chips to large QFNs, adapting seamlessly to your design’s complexity.
Quality Assurance: 3D AOI, X-ray inspection, and functional testing to IPC-A-610 standards.
Accredited Compliance: We are IATF-16949, ISO-9001 & ISO-14001 certified.
Box Build Integration: Performance Meets Affordability
Our box build solutions strike the optimal balance between performance and cost:
Design-for-manufacturability (DFM): Optimize mechanical layouts and effective material selection for competitive pricing.
End-to-end Testing: Validate EMI shielding, thermal cycling, and MIL-SPEC environmental resilience.
Low-to-high Volume: We deliver solutions that scale from one-off prototypes to large-batch runs.
Precision Dicing Services
Our in-house dicing solutions deliver finish goods with zero defects in coated or uncoated substrates—ensuring pristine surfaces for optical, RF, and photonic systems
Material-Specific Expertise
We precision-cut advanced substrates, including:
Ceramics
Glass & Quartz
Silicon
Engineered for Your Demands
Ultra-tight tolerances: ±15µm dimensional accuracy.
Scalable workflows: From low-volume, high-mix R&D batches to high-volume mass production runs
Fiber Laser Solutions for Complex Ceramics
We utilize fiber-laser technology to enable complex designs and deliver cost-effective solutions for custom ceramic circuitry.
Our precision drilling ensures flawless micro-vias and cavities in ceramics and delicate substrates; achieving compact, thermally stable designs without compromising structural integrity.
Resistor Performance You Can Rely On
Our laser-trimming services produce resistor networks and custom voltage dividers with ±0.5% tolerance; engineered for stability under harsh conditions.
We can achieve micron-level adjustments to target resistance values, ensuring minimal drift across temperature and voltage fluctuations.
Precision Interconnects for Tomorrow’s Miniaturized Electronics
We deliver both flip chip assemblies and wire bonding services tailored to your needs.
Flip chip is utilized for enhanced signal speed and thermal efficiency, while our gold wire bonding ensures robust and reliable connections.
Advanced Bonding Solutions
Flip chip
Ball bonding
COB bonding
- Die Bonding
Validate Your Designs Under Real-World Stress
Your components, PCBs, or assemblies—your specifications, our validation.
Define the conditions, standards, and protocols; we execute with precision to ensure your product survives harsh environments and extended lifespans
Custom Testing, Your Way
Standards: MIL-STD-810, IEC 60068, JEDEC JESD22, IPC-9701, or custom protocols.
Duration: Hours, days, or accelerated lifetime simulations (e.g., 10+ years of operation in weeks).
Core Testing Capabilities
Thermal Shock & Cycling
Humidity & Corrosion
Power Cycling
Vibration & Shock
Your Vision. Our Craft.
Engineered to outperform. Built to endure